Discover how thermal interface materials improve cooling and performance in AI hardware, high-performance computing, and data centers.

Short educational video explaining microelectronics packaging and its importance in semiconductor performance and reliability.

Learn how phase diagrams guide development of lead-free, low-temperature solder materials for microelectronics packaging.

Discover how Thermo-Calc helps students design solder materials and apply microelectronics concepts in engineering classrooms.

Step-by-step guide to creating phase diagrams with ThermoCalc for semiconductor materials and microelectronics research.

Discover how 2D materials enable new possibilities in microelectronics, semiconductor devices, and advanced technologies.

Explore thermal transport in layered semiconductor materials and its role in device performance and packaging.

Learn how chiplet architectures are shaping the future of semiconductor design and advanced packaging.

Explore how advanced packaging technologies could extend Moore’s Law and improve semiconductor performance.

Overview of emerging semiconductor technologies driving innovation in electronics, computing, and next-generation devices.

Explore advanced semiconductor packaging technologies enabling 2.5D and 3D heterogeneous chip integration.

Course exploring mechanical properties and materials processes used in microelectronics manufacturing.

Learn how heterogeneous integration and advanced packaging combine multiple chip technologies to improve semiconductor performance.

Explore radiation effects challenges in heterogeneously integrated microelectronics and advanced semiconductor packaging.

Overview of heterogeneous integration and advanced packaging technologies enabling next-generation semiconductor systems.