Thermal Interface Materials (TIM) Strategies for AI and Data Centers (Webinar)

As AI and high-performance computing (HPC) systems continue to raise the bar for power and performance, heat management has become one of the most demanding design challenges. This webinar highlights the essential role of Thermal Interface Materials (TIMs) in maintaining reliable thermal performance for next-generation GPUs and processors operating at power densities above 1000 W per device.

Participants will learn about core TIM selection criteria, practical performance comparisons in real applications, and emerging material innovations that help AI and HPC hardware run safely and efficiently under extreme workloads.