TECHNICAL VERTICALS
System-on-Chip
Compressing required components into a single chip
Moore’s law has driven an exponential increase in the number of devices that can fit onto a single chip, ushering in an era where most electronic systems contain chips that integrate various previously discrete components, such as microprocessors, DSPs, dedicated hardware processing engines, memories, and interfaces to I/O devices and off-chip storage.
Today, most electronic systems—cell phones, iPods, set-top boxes, digital TVs, automobiles—contain at least one System-on-Chip (SoC). Designing SoCs is a highly complex process. Before entering the traditional VLSI implementation stages (RTL, logic, and physical design), designers must tackle the challenging tasks of developing a functional specification, partitioning and mapping functions onto hardware components and software, creating a communication architecture to interconnect components, and performing functional, performance, and power analysis and validation.
SCALE participates in the Center for Secure Microelectronics Ecosystem (CSME), a partnership between industry, academia, and the U.S. government to advance the field of secure microelectronics. More information is available on the CSME website.
Partners in System-on-Chip
OHIO STATE UNIVERSITY — TECH LEAD
PURDUE UNIVERSITY — TECH LEAD
GEORGIA TECH
UNIVERSITY OF CALIFORNIA — BERKELEY
UNIVERSITY OF SAINT THOMAS
MORGAN STATE UNIVERSITY
Technical Leads
-
![A middle-aged man with glasses, wearing a dark shirt and a patterned tie, against a blue background.]()
Steve Bibyk
The Ohio State University
Research Focus
Trust and assurance of secure electronic systems, rapid prototyping of embedded systems, reincarnating art and technology pieces for education of innovation and inventing.
-
![Professional headshot of a man with dark hair slicked back, wearing a black suit and dark shirt, smiling softly against a gray background.]()
Ayman Fayed
The Ohio State University
Research Focus
Dr. Fayed’s main area of expertise is in the field of analog, mixed-signal, and power management Integrated Circuits design. His current research interests include on-chip power supplies for dynamic energy distribution in System-on-Chip (SoCs) and multi-core CPUs, high-frequency switching regulators with on-chip and on-package passives, low-noise power supplies and power supply modulators for analog and RF circuits, energy-harvesting platforms for power-restricted & remotely-deployed systems, fully-integrated power converters in SiC and GaN technologies.
Faculty
-
![A middle-aged man with glasses and gray hair, wearing a tan blazer and white shirt, smiling outdoors.]()
Mark Johnson
Purdue University
-
![A middle-aged man with glasses and a salt-and-pepper beard wearing a black jacket, smiling slightly in front of a plain background.]()
Kevin Kornegay
Morgan State University
-
![Portrait of a middle-aged man with gray hair, wearing a tan blazer and a light blue shirt, smiling slightly.]()
Borivoje Nikolic
University of California - Berkeley
-
![A man in a dark suit and white shirt, posing for a portrait against a gray background.]()
Anand Raghunathan
Purdue University
-
![Headshot of a man with short dark hair, wearing a blue checkered shirt, against a gray background.]()
Hassan Salamy
University of St. Thomas
-
![Headshot of an Asian man with short black hair, wearing glasses and a light pink collared shirt, against a grey textured background.]()
Shimeng Yu
Georgia Institute of Technology
