The Road Ahead (Current and Future state of Chiplets)

The speaker discusses the current state and future prospects of chiplet technology, highlighting its potential to revolutionize the industry. They mention that the DoD has awarded contracts to build the first set of chiplets under the Steampi program, which indicates that this technology is gaining momentum. The speaker also notes that they have worked with universities in the past to develop student projects and internships, and hopes to replicate this success in the near future.
The main points discussed include the feasibility of designing chiplets on older technology (such as 90 nanometer) for training purposes, the potential applications of advanced packaging and 3D assembly, and the possibility of using existing resources to develop new technologies. The speaker also mentions the availability of funding through programs like ME Commons and AIRI, which could be leveraged to support student projects and workforce development initiatives. Overall, the speaker is optimistic about the future prospects of chiplet technology and its potential to drive innovation in the industry.