Converging Multi-Substrate Processing Technologies for 2.5D and 3D Heterogeneous Integration

The course "Converging Multi-Substrate Processing Technologies for 2.5D and 3D Heterogeneous Integration" focuses on the development of novel processing technologies that can integrate multiple substrates, enabling the creation of complex 2.5D and 3D heterogeneous systems. The main goal is to converge various substrate processing techniques, such as electroplating, surface preparation, and waveguide integration, to create a unified framework for designing and fabricating these complex systems. This involves exploring the advantages and limitations of different substrates, including aluminum nitride, glass, and silicon, in terms of their ability to accommodate high-frequency RF signals, photonic applications, and other technologies.
The course delves into various aspects of substrate processing, including surface preparation, electroplating, and waveguide integration. It also touches on the challenges associated with radiation testing and the use of facilities such as the Purdue One nuclear reactor and the prime lab for exposing devices to alpha and heavy ion particles. Additionally, the course discusses the importance of interconnects in chiplet-based systems and the need for high-quality electroplating. The material aims to provide students with a comprehensive understanding of the complexities involved in converging multi-substrate processing technologies for 2.5D and 3D heterogeneous integration, enabling them to design and fabricate innovative systems that integrate multiple substrates and technologies.