Introduction to Heterogeneous Integration and Electronics Packaging (Course)

This course provides a broad, hands-on introduction to principles and practices of electronics packaging. The course is broadly divided into four major modules as well as other smaller modules. The major modules provide a practical background (as it relates to electronic packaging) in electrical, thermal, mechanical and materials characterization. Design considerations as well as materials selection in the above topics will also be addressed. The minor modules include package fabrication and assembly, radiation hardening, and statistical modeling and data analysis. The class will be primarily lab-oriented with 1 lecture each week and 4 hours of hands-on lab.