MSE 382 Exploring Mechanical Properties and Processes in Microelectronics

Summary: This material introduces students to the crucial role of mechanical properties in microelectronics, particularly concerning interfaces between dissimilar materials. It highlights how differences in thermal expansion can induce stress and lead to device failure, emphasizing the importance of understanding fracture toughness and failure stress. The core of the lesson focuses on leveraging Large Language Models (LLMs) – like ChatGPT – as tools for quickly retrieving material property data and generating Python code for analysis and visualization.
The teaching material guides students through a practical activity where they use LLMs to gather data on polymers used in semiconductor devices – including CTE, Young's modulus, and tensile strength – and then visualize this data using Jupyter Notebooks. Students are instructed to verify the accuracy of the LLM-provided information by cross-referencing it with original sources. The lesson emphasizes not only the technical aspects of material properties but also the effective use of AI tools in materials science research and the importance of documenting and sharing work through platforms like NanoHub.