Will Advanced Packaging Save Moore's Law?

The teaching material "Will Advanced Packaging Save Moore's Law?" discusses the challenges facing the semiconductor industry in maintaining the pace of innovation set by Gordon Moore's law. The industry is shifting towards advanced packaging, which involves stacking multiple layers of transistors and interconnects to increase computing power while reducing size and energy consumption. However, this shift also requires significant changes in manufacturing processes, materials, and equipment.
The material highlights the importance of workforce development in addressing these challenges. It notes that the skills required for advanced packaging are similar to those needed for other applications in the industry, such as traditional logic memory. As a result, companies like LAM are looking for process and product engineers with advanced degrees, particularly in chemical engineering, chemistry, materials science, and mechanical engineering. The material also touches on the need for outreach programs to attract students from these fields who may not be aware of the opportunities available in the semiconductor industry.