SCALE Heterogeneous Integration & Advanced Packaging (HIAP)
Professor Shubhra Bansal of Purdue University presented at an HIAP information session.
The SCALE Heterogeneous Integration & Advanced Packaging (HIAP) technical vertical addresses the rapidly evolving field of microelectronics packaging, a critical enabler for high‑performance, miniaturized electronic systems. By focusing on the integration of diverse semiconductor dies and the management of electrical, thermal, and mechanical interfaces, the program supports the United States’ strategic goal of maintaining a competitive semiconductor manufacturing base. The initiative is funded by the Department of Defense and coordinated through a growing network of university partners.
The presentation delineates the hierarchical structure of electronic packaging, from chip‑on‑interposer assemblies to substrate and printed‑circuit‑board integration, and explains how heterogeneous integration combines dissimilar dies—such as processors, memory, sensors, and photonic components—into unified packages. It distinguishes 2‑D, 2.5‑D, and 3‑D stacking approaches, exemplified by AMD’s 3‑D chiplet and Intel’s Foveros technologies, and discusses the co‑design of electrical, thermal, and mechanical aspects required for reliable advanced packages. Material selection, process development, reliability challenges, and low‑TRL research opportunities are highlighted as key technical domains within the HIAP vertical.
With this knowledge, learners can articulate the structure and hierarchy of electronic packaging and explain the concept and advantages of heterogeneous integration, including size reduction, performance enhancement, and functional diversification. They become equipped to identify research and funding opportunities offered by the HIAP program and to navigate the collaborative ecosystem of partner institutions—Purdue, Georgia Tech, SUNY Binghamton, Arizona State University, UT El Paso, University of Florida, and University of Central Florida—and the faculty resources available through the Advanced System Integration and Packaging Center for advanced packaging research.