MSE 382 Exploring Mechanical Properties and Processes in Microelectronics

Graduate student Robert Appleton and Professor Ale Strachan of Purdue University present the use of prompt engineering best practices in predicting mechanical failure modes. This resource also includes a homework assignment.

Learning objectives

• Explore mechanical processes, including failure, in microelectronic applications

  • Mechanics of thin films and thermal stresses

  • Fracture toughness and failure stress

• Use large language models (LLM) and coding in the context of engineering applications

  • Use an LLM to collect data and verify their origin and accuracy

  • Use an LLM to generate code and make simple modifications

  • Perform simple data manipulation and visualization using Jupyter notebooks