Optimizing Packaging Technologies for High-Power, RF, and High-Radiation Environments

This 1-credit course provides a focused overview of the challenges and solutions associated with electronic packaging for high-power, radio-frequency (RF), and high-radiation environments, particularly in space and defense applications. Topics include space radiation environments and effects, packaging strategies to achieve high reliability and radiation effects mitigation, as well as facilitate thermal management. Special issues associated with wide-bandgap semiconductor-based power and RF devices will be discussed. The course also introduces key qualification methods used for space operation. This condensed format is designed for engineers, researchers, and students seeking essential knowledge on packaging reliability for extreme environments.

This course is designed to provide a high-level yet practical overview of packaging for extreme  environments. Students are encouraged to engage with real-world case studies and explore  industry applications to enhance learning outcomes.

This course includes 15 lectures divided by topic into 5 modules. Each module concludes with a brief assessment.

Format: Online, asynchronous
Platform: Canvas via nanoHUB
Estimated Time: 13 hours
Level: Advanced Undergraduate/Graduate Student
Prerequisites: Knowledge of basic concepts of electronic devices, circuit operation, principles of electromagnetics, and/or semiconductor physics, some experience with power electronics, radiation effects on microelectronics, principles of heat flow, and/or fundamentals of material science
Instructor: Professor Enxia Zhang of the University of Central Florida


Course Objectives

  1. Understand the space radiation environment and its effects on packaged electronic components. 

  2. Identify failure mechanisms due to ionizing radiation, displacement damage, and electromagnetic discharge or interference. 

  3. Evaluate packaging techniques for high-power and RF applications in extreme  environments. 

  4. Assess basic heat dissipation methods for high-performance electronic systems.

  5. Have familiarity with qualification standards for space and defense electronics. 

 

Request Course Enrollment

To enroll in this course, complete the course registration form. The SCALE team will review your request and arrange enrollment in the Canvas course on nanoHUB.

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Packaging Design, Co-Design and Modeling Principles

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Introduction to Semiconductor Packaging