This 1-credit course focuses on the fundamentals of semiconductor packaging, including the historical evolution of integrated circuit packaging, the advanced packaging ecosystem, packaging assembly processes, interconnect technologies, and interposer-based integration. The course emphasizes the role of advanced packaging in modern semiconductor systems and its impact on performance, reliability, and future technology scaling in the semiconductor industry.
This course includes 11 lectures divided by topic into 5 modules. Each module concludes with a brief assessment.
Format: Online, asynchronous
Platform: Canvas via nanoHUB
Estimated Time: 7 hours
Level: Advanced Undergraduate/Graduate Student
Prerequisites: Fundamental knowledge of Basic Electronics, Semiconductor Fundamentals, Materials Science, Manufacturing Processes, Thermal and Mechanical Principles
Instructor: Professor Navid Asadizanjani, University of Florida
Course Objectives
Explain the evolution of semiconductor packaging, including past, current, and emerging technologies
Describe key components of advanced packaging, such as assembly processes, interconnects, substrates, and materials
Analyze how advanced packaging impacts the performance of modern semiconductor devices
Identify current industry challenges and opportunities in advanced packaging
Summarize the requirements and future direction of advanced packaging technologies
Request Course Enrollment
To enroll in this course, complete the course registration form. The SCALE team will review your request and arrange enrollment in the Canvas course on nanoHUB.