This 1-credit module provides a comprehensive introduction to 2.5D and 3D IC Technologies. This course provides an introduction to the technologies, materials, and manufacturing processes that enable advanced 2.5D and 3D integrated circuit packaging.
This course provides an overview of the materials, processes, and technologies that enable advanced 2.5D and 3D integrated circuit (IC) packaging. Topics include advanced package substrates, high-density interconnect fabrication, heterogeneous integration, advanced assembly methods, thermal management, reliability, and characterization techniques. The course also examines emerging materials and manufacturing approaches that support next-generation microelectronics systems for applications such as artificial intelligence, high-performance computing, communications, and defense.
Format: Online, asynchronous
Platform: Canvas via nanoHUB
Estimated Time: 11 hours
Level: Advanced Undergraduate/Graduate Student
Prerequisites: Prior exposure to semiconductor fundamentals, basic electronic circuits, and materials
Instructor: Professor Muhannad S. Bakir of the Georgia Institute of Technology
Course Objectives
Develop a strong understanding of advanced semiconductor packaging architectures, including 2.5D, 3D, chiplet-based, and heterogeneous integration technologies.
Analyze the properties and selection of advanced substrate materials, including glass, silicon, and organic substrates, and evaluate their impact on electrical, thermal, and mechanical performance.
Examine manufacturing processes used in advanced packaging, including glass structuring, dielectric deposition, photolithography, semi-additive processing, electroplating, flip-chip assembly, thermal compression bonding, and hybrid bonding.
Evaluate thermal management, reliability, and materials characterization techniques used to optimize package performance and ensure long-term reliability in advanced electronic systems.
Explore emerging materials and technologies for next-generation advanced packaging, including embedded passive components, functional materials, high-density interconnects, and advanced thermal interface materials supporting AI, high-performance computing, and heterogeneous integration.
Request Course Enrollment
To enroll in this course, complete the course registration form. The SCALE Team will review your request and arrange enrollment in the Canvas course on nanoHUB.