This 1-credit course provides a comprehensive overview of semiconductor package assembly, reliability testing, and failure analysis.
Semiconductor packaging serves several essential functions, including electrical interconnection, mechanical and environmental protection, and thermal management. Students will explore the fundamentals, materials, and processes involved in electrical interconnections at the chip, package, and system levels. The course also examines protective packaging techniques, including polymer-based processes such as underfilling and molding, with detailed explanations and demonstrations of common assembly methods.
Reliability testing is critical to ensuring the performance, safety, and cost-effectiveness of semiconductor devices. Students will learn about various reliability assessment methods, the equipment used to conduct testing, and how to interpret and apply the resulting data.
Finally, the course introduces the fundamentals of failure analysis, emphasizing that identifying the root cause of a failure requires more than simply examining damaged components. Through practical examples and case studies, students will develop an understanding of failure mechanisms, fault isolation techniques, and methods for reproducing failures to support accurate diagnosis and corrective action.
This course includes 15 lectures divided by topic into 5 modules. Each module concludes with a brief assessment.
Format: Online, asynchronous
Platform: Canvas via nanoHUB
Estimated Time: 11 hours
Level: Advanced Undergraduate/Graduate Student
Prerequisites: Knowledge of electrical circuits, semiconductor fundamentals, materials science
Instructor: Professor SB Park of Binghamton University
Course Objectives
Develop a strong understanding of the basic methods of electrical interconnection and polymeric protection
Understand the needs of various reliability assessment methods and usage of the acquired data
Explore failure analysis, fault isolation, and proper tools to address
Request Course Enrollment
To enroll in this course, complete the course registration form. The SCALE team will review your request and arrange enrollment in the Canvas course on nanoHUB.