Reliability Engineering for Electronic Packaging

Reliability Engineering is a sub-discipline of systems engineering that emphasizes the ability of a system or component to function without failure. This course covers concepts and methods to evaluate the reliability that can be used for electronic components and assemblies. The primary focus is on reliability methods, reliability and failure distributions, reliability of systems, and analyzing reliability data.

This course includes 12 lectures divided by topic into 5 modules. Each module concludes with a brief assessment.

Format: Online, asynchronous
Platform: Canvas via nanoHUB
Estimated Time: 10 hours
Level: Advanced Undergraduate/Graduate Student
Prerequisites: Foundational knowledge of calculus, probability, and statistics. Familiarity with electronic components and circuits.
Instructor: Professor Saad Hamasha of Binghamton University


Course Objectives

  1. Establish fundamental knowledge of reliability engineering

  2. Pioneer reliability engineering methods for electronics 

  3. Evaluate reliability of electronic products and assemblies 

  4. Analyze reliability data and develop reliability models

Request Course Enrollment

To enroll in this course, complete the course registration form. The SCALE team will review your request and arrange enrollment in the Canvas course on nanoHUB.

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Statistical Process Control for Microelectronics Packaging

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Packaging Design, Co-Design and Modeling Principles