This course provides a comprehensive introduction to heterogeneous integration and electronics packaging.
Electronic packaging plays a critical role in the performance and reliability of today's advanced electronic systems, from consumer devices to aerospace and defense technologies. In this course, you will explore how electrical, thermal, mechanical, and material properties influence the design and performance of electronic packages.
Through lectures on a variety of topics, you will learn how to evaluate materials, characterize package performance, and make design decisions that balance competing engineering requirements.
What You'll Learn
The course focuses on four major areas: electrical, thermal, mechanical, and materials characterization. You will also explore package fabrication and assembly, radiation hardening techniques, statistical reliability modeling, and data analysis.
Format: Online, asynchronous
Platform: Canvas via nanoHUB
Estimated Time: 25 hours
Level: Advanced Undergraduate/Graduate Student
Prerequisites: Basic thermodynamics and introductory heat transfer
Instructor: SCALE Faculty
Course Objectives
Explain the fundamental principles of heterogeneous integration and electronics packaging.
Evaluate electrical, thermal, mechanical, and materials considerations in electronic packaging.
Describe and compare common packaging materials, fabrication processes, and assembly techniques.
Analyze packaging reliability and failure mechanisms.
Apply statistical modeling and data analysis techniques to interpret manufacturing and reliability data, evaluate component performance, and support engineering decisions.
Explain the effects of radiation on semiconductor devices and advanced electronic packages.
Request Course Enrollment
To enroll in this course, complete the course registration form. The SCALE team will review your request and arrange enrollment in the Canvas course on nanoHUB.